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LED封裝膠的現(xiàn)狀及應(yīng)用
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更新日期： 2021-1-12 |
LED產(chǎn)品作為皇冠上的明珠，已廣泛地應(yīng)用在指示、背光、顯示、照明等應(yīng)用方向，應(yīng)用領(lǐng)域涵蓋消費(fèi)類電子業(yè)、汽車(chē)業(yè)、廣告業(yè)、交通業(yè)、體育業(yè)、娛樂(lè)業(yè)、建筑業(yè)等全方位領(lǐng)域。而LED封裝作為上游產(chǎn)業(yè)，更是重中之重，決定了使用壽命和透光程度。
As the jewel in the crown, LED products have been widely used in indications, backlight, display, luminaire and other applications. The application fields cover consumer electronics, automotive, advertising, transportation, sports, entertainment, construction and other all-round areas. As an upstream industry, LED encapsulation is the top priority, which determines the service life and the degree of light transmission.
LED封裝膠概況/LED Encapsulant Overview
LED(Light Emtting Diode)全稱發(fā)光二極管，是一種可以將電能轉(zhuǎn)化為光能的半導(dǎo)體材料。
LED (Light Emitting Diode) stands for light-emitting diode, which is a semiconductor material that can convert electrical energy into light energy.
LED 封裝技術(shù)目前主要往高發(fā)光效率、高可靠性、高散熱能力與薄型化4個(gè)方向發(fā)展，主要的亮點(diǎn)有硅基LED、板上芯片封裝(COB)技術(shù)、復(fù)晶型LED芯片封裝、高壓LED等。在這些封裝形式中，相應(yīng)的材料也各不相同。
LED encapsulation technology is currently mainly developing in four directions: high luminous efficiency, high reliability, high heat dissipation capacity and thinning. The main highlights are silicon-based LED, chip-on-board (COB) technology, polycrystalline LED chip encapsulation, high-voltage LED, etc. In these encapsulation forms, the corresponding materials are also different.
LED封裝膠是LED封裝材料的總稱，俗稱LED膠水。之前，LED封裝膠的成分主要是普通環(huán)氧樹(shù)脂，但因其耐熱、耐紫外能力較弱以致于膠體容易變黃，影響透光效果，而脂環(huán)族環(huán)氧樹(shù)脂因具有耐高溫、耐紫外老化等優(yōu)異性能，已經(jīng)在高端的產(chǎn)品應(yīng)用上取代了環(huán)氧樹(shù)脂。
LED encapsulation adhesive is also called LED encapsulant or LED adhesive. Previously, the main component of LED encapsulant was ordinary epoxy resin, but because of its weak heat and UV resistance, the gel easily turns yellow and affects the light transmission effect. Cycloaliphatic epoxy resin has high temperature resistance, strong UV resistance and excellent anti-aging properties, etc. Thus it has replaced ordinary epoxy resin in high-end product applications.
LED封裝膠發(fā)展歷程/LED Encapsulant History
1960s-1980s 以GaP、GaN為基礎(chǔ)的LED研究獲得突破GaP, GaN-based LED research has achieved breakthroughs
1993 LED全彩化由日亞化工實(shí)現(xiàn) LED full color is realized by Nichia Chemical.
1998 SMD LED封裝工藝出現(xiàn)SMD LED encapsulation technique appeared.
2008 出現(xiàn)COB封裝工藝 COB encapsulation technique appeared.
2013 出現(xiàn)基于Flip Chip的無(wú)引線封裝 Flip Chip-based leadless encapsulation appeared.
LED封裝膠產(chǎn)業(yè)分析/LED Encapsulant Industry Analysis
上游 Upstream Industry
封裝材料：有機(jī)硅、環(huán)氧樹(shù)脂、PCT
Encapsulation materials: organic silicon, epoxy resin, PCT
LED芯片制造 LED chip manufacture
中游 Midstream Industry
LED封裝 LED encapsulation
下游 Downstream Industry
液晶背光源 LCD backlight
LED顯示屏 LED display
LED車(chē)燈 LED car lights
景觀燈飾 Landscape lighting
特殊照明 Special lighting
交通信號(hào)燈 Traffic lights
LED封裝膠行業(yè)壁壘/LED Encapsulant Industry Barriers
技術(shù)壁壘 Technical barriers
LED封裝生產(chǎn)涉及封裝材料、光學(xué)性能測(cè)試、自動(dòng)化工藝技術(shù)與控制。
LED encapsulant production involves encapsulation material, optical performance testing, automated technology and control.
資金壁壘 Financial barriers
LED封裝產(chǎn)線和設(shè)備的購(gòu)置與運(yùn)行需要大量資金。
The purchase and operation of LED encapsulant production line and equipment require a lot of capital.
客戶壁壘 Customer barriers
產(chǎn)業(yè)下游LED顯示屏、背光、汽車(chē)等領(lǐng)域客戶較為集中，具有嚴(yán)格的供應(yīng)商認(rèn)證體系，認(rèn)證周期長(zhǎng)，對(duì)企業(yè)的供給能力、資金能力、研發(fā)能力要求嚴(yán)格。
In a downstream industry, customers are concentrated in LED display, backlight, automotive and other fields, where there are strict supplier certification system, long certification cycle, as well as strict requirements on the company's supply capacity, capital capacity and R&D capacity.
退出壁壘 Exit barriers
LED封裝產(chǎn)業(yè)前期產(chǎn)線和設(shè)備投入較大。
Large investment in early production lines and equipment for the LED encapsulation industry.
LED封裝膠市場(chǎng)分析/LED Encapsulant Market Analysis
中國(guó)LED照明市場(chǎng)規(guī)模 China LED lighting market size
中國(guó)是LED照明產(chǎn)品最大的生產(chǎn)制造國(guó)，隨著國(guó)內(nèi)LED照明市場(chǎng)滲透率快速攀升至七成以上，LED照明已基本成為照明應(yīng)用的剛需，國(guó)內(nèi)的LED照明市場(chǎng)規(guī)模呈現(xiàn)出較全球平均水平更快的增長(zhǎng)勢(shì)頭。據(jù)統(tǒng)計(jì)，中國(guó)LED照明市場(chǎng)產(chǎn)值規(guī)模由2015年的2596億元增長(zhǎng)到2018年的4155億元，年均復(fù)合增長(zhǎng)率達(dá)到16.97%，增速高于全球平均水平。預(yù)計(jì)到2021年，中國(guó)LED照明市場(chǎng)產(chǎn)值有望達(dá)到5900億元，2019-2021年仍有望能保持超過(guò)12%的年均復(fù)合增長(zhǎng)水平。
China is the largest manufacturer of LED lighting products. With the domestic LED lighting market penetration rate quickly climbed to more than 70%, LED lighting has become a necessity in lighting application. The domestic LED lighting market size shows a faster growth momentum than the global average. According to statistics, the output value of China's LED lighting market increased from 259.6 billion yuan in 2015 to 415.5 billion yuan in 2018, with a compound annual growth rate of 16.97 percent, higher than the global average. China's LED lighting market is expected to reach 590 billion yuan by 2021. It is still expected to maintain a compound annual growth rate of more than 12% in 2019-2021.
Picture 1: Chinese LED lighting market size and growth trend from 2016 to 2021
Picture 2: Market share of global LED encapsulantsupply source from 2016 to 2019 (unit: %)
中國(guó)大陸在近10年內(nèi)承接了全球產(chǎn)業(yè)轉(zhuǎn)移，根據(jù)LEDinside統(tǒng)計(jì)，2019年中國(guó)大陸在全球LED封裝供給端的市占率達(dá)到71%，海外產(chǎn)能主要聚焦于車(chē)用照明等相對(duì)高端的市場(chǎng)需求，而通用照明、景觀照明、LED顯示和背光等傳統(tǒng)應(yīng)用大部分來(lái)自大陸供應(yīng)商。
Chinese mainland has undertaken global industrial shift in the past 10 years. According to LEDinside statistics, in 2019 Chinese mainland market share on the global LED encapsulant supply source reached 71%. Overseas production capacity is mainly focused on vehicle lighting and other relatively high-end market demand. General lighting, landscape lighting, LED display, backlighting and other traditional applications mostly come from Chinese mainland suppliers.
目前中游封裝是我國(guó)LED產(chǎn)業(yè)發(fā)展相對(duì)成熟的環(huán)節(jié)，國(guó)內(nèi)企業(yè)發(fā)揮規(guī)模優(yōu)勢(shì)，自2010年開(kāi)始進(jìn)入高速發(fā)展期，2015年后逐漸趨于平穩(wěn)，但仍保持每年10%以上的增速。根據(jù)高工LED預(yù)測(cè)數(shù)據(jù)，2018年國(guó)內(nèi)LED封裝產(chǎn)值超過(guò)1000億元，而2020年預(yù)計(jì)達(dá)1288億元。
At present, the midstream encapsulant industry is a relatively mature link in the development of China's LED industry. Domestic enterprises play the scale advantages. Since 2010 they have begun to enter a period of high-speed development. After 2015 they gradually leveled off, but they still maintain an annual growth rate of more than 10%. According to the forecast data of Gaogong LED, the output value of domestic LED encapsulation will exceed 100 billion yuan in 2018, while it is expected to reach 128.8 billion yuan in 2020.
LED封裝膠行業(yè)發(fā)展趨勢(shì)/LED Encapsulant Industry Development Trend
國(guó)內(nèi)LED封裝材料在研究和應(yīng)用上都與國(guó)外尚有一定的差距。高折光的封裝材料的產(chǎn)品雖然已進(jìn)入市場(chǎng)，但由于在可靠性方面存在的問(wèn)題，無(wú)法在高質(zhì)量要求的LED器件上得到應(yīng)用。高端封裝材料的市場(chǎng)基本上被國(guó)外大公司的產(chǎn)品所壟斷。國(guó)內(nèi)所研制或生產(chǎn)的材料和國(guó)外產(chǎn)品相比還存在光通量偏低、粘結(jié)性差或吸水率偏高等缺點(diǎn)。由于幾大國(guó)外企業(yè)控制對(duì)國(guó)內(nèi)銷售關(guān)鍵原料，以保持自身膠水在市場(chǎng)的壟斷地位，國(guó)內(nèi)企業(yè)需要不斷解決原材料自主合成問(wèn)題，打破外國(guó)公司對(duì)原料的壟斷和控制，并在生產(chǎn)設(shè)備和工藝上自主創(chuàng)新，防止陷入國(guó)外企業(yè)的專利陷阱。隨著市場(chǎng)的推動(dòng)和大量企業(yè)資金的投入，技術(shù)難題將不斷被研發(fā)人員解決，國(guó)內(nèi)的LED封裝膠材料必將趕上進(jìn)口封裝膠材料。
There is still a certain gap in research and application when comparing the domestic LED encapsulating materials with that of foreign countries. Although the high refractive index encapsulating materials have entered the market, they cannot be applied to high-quality LED devices due to reliability problems. The market for high-end encapsulating materials is basically monopolized by large foreign companies. Compared with foreign products, domestically developed or produced materials still have disadvantages such as low luminous flux, poor adhesion, or high water absorption. As several major foreign companies control their domestic sales of key raw materials in order to maintain their own adhesive market monopoly, domestic companies need to continuously solve the problem of independent synthesis of raw materials, break the monopoly and control of raw materials by foreign companies, and independently innovate production equipment and processes to prevent them from falling into the patent trap of foreign companies. With the promotion of the market and the investment of a large amount of corporate funds, technical problems will continue to be solved by R&D personnel, and domestic LED encapsulating materials will certainly catch up with imported encapsulating materials.
脂環(huán)族環(huán)氧樹(shù)脂具有優(yōu)異的加工性、熱穩(wěn)定性、電絕緣性和耐紫外輻射等綜合性能，非常適合應(yīng)用在LED封裝膠領(lǐng)域中。新納希經(jīng)過(guò)十多年的經(jīng)驗(yàn)積累和不斷地改革與創(chuàng)新，現(xiàn)已成長(zhǎng)為一家生產(chǎn)經(jīng)驗(yàn)豐富、產(chǎn)品質(zhì)量穩(wěn)定、專業(yè)的脂環(huán)族環(huán)氧樹(shù)脂生產(chǎn)企業(yè)。一份付出，一份收獲，一份信任，倍增回饋，新納希會(huì)繼續(xù)以優(yōu)質(zhì)的產(chǎn)品和服務(wù)感謝您的支持!
Cycloaliphatic epoxy resin is ideal for use in LED encapsulant due to its excellent processing property, good thermal stability, electrical insulation and strong UV radiation resistance. After more than ten years of experience and continuous reform and innovation, Synasia has grown into a specialized cycloaliphatic epoxy resin manufacturer with rich production experience and premium product quality. We fully understand that long term business is highly dependable on customer trust. Synasia will continue providing high quality products and excellent services to thank you for your support!
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